Epoxy Fillet Height Study of Tapeless QFN Leadframe Package on Different Diebonders

Jr., E. Graycochea and Rodriguez, R. and Gomez, F. R. (2021) Epoxy Fillet Height Study of Tapeless QFN Leadframe Package on Different Diebonders. Journal of Engineering Research and Reports, 20 (8). pp. 18-21. ISSN 2582-2926

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Official URL: https://doi.org/10.9734/jerr/2021/v20i817353

Abstract

The paper focused on the evaluation of quad-flat no-leads (QFN) device in tapeless leadframe technology on different diebonder platforms to achieve an acceptable fillet height performance. The study was narrowed down into two main machines with the objective of attaining a fillet height of less than 75 % for small die. Eventually, the fillet height requirement was achieved by both diebonder platforms, hence, these machines could be used for future works on devices with similar requirement.

Item Type:	Article
Subjects:	Afro Asian Archive > Engineering
Depositing User:	Unnamed user with email support@afroasianarchive.com
Date Deposited:	20 Feb 2023 10:37
Last Modified:	29 Apr 2024 07:50
URI:	http://info.stmdigitallibrary.com/id/eprint/119

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